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UKEO is a power strip with usb factory. It has its own trading company and factory. It is a company integrating industry and trade. It provides OEM&ODM support for product customization, and can design packaging. Our products include voltage regulators, power strips, conversion plugs, extension cords, etc. ,Welcome Inquiry.
| Model: | CRGE-U | CREU-U |
| Material: | PC (Flame Retardant) | |
| Input: | AC 110V-240V 50/60Hz Max 0.38A | |
| Output: | DC 5V(±5%) 3.2A（Maximum output3.2A） | |
| Rated power: | 15W | |
| wire diameter: | 0.5m² | |
| Length of cable: | 1.5m | |
| Net. weight: | 142g | |
| Gross weight: | 156g | |
| Qty/carton: | 60pcs | |
| Carton weight: | 12kg | |
| Product size: | 8.7cm*3.8cm*12.5cm | |
| Box size: | 9cm*4cm*12.5cm (Paper box) | |
| Carton size: | 45cm*32cm*23cm | |
As a power strip with usb factory, we have the ability to design and produce a variety of semi-finished products, including usb interface and its connected circuit board. Let UKEO tell you the process of PCB board production.
The circuit board's substrate material is delicate, less than 0.025 feet thick, and consists of a glassy resin base with copper on top. We cut it to fit the board's specifications and purify the copper surface with inner processes.
The Inner Layer Process is crucial to circuit board manufacturing. It has intricate rituals and refined techniques, each essential to success. It includes laying down dry film photosensitive coating, exposing it to light, removing excess photosensitive film, and etching the copper layer below.
During the Inner Layer Process, we do many activities to achieve perfection. We remove the photosensitive film with care, use an automatic optical inspection process to verify the accuracy of etching, and apply an oxide coating. The ultimate step is pressing down with immense force to manifest the circuit board.
This film reacts to ultraviolet light with heat and pressure on copper.
We put dry film on the substrate board.
We use an image tool to imprint the wiring diagram.
Each board has a specific wiring diagram.
Skilled engineers craft each diagram meticulously.
Every surface has its unique wiring diagram.
They all work together harmoniously.
In the quest to produce an accurate image of the circuit pattern, a process is initiated whereby photographic film is utilized as a medium. The said film is subjected to a process of exposure which exposes certain parts of the film to an external stimulus that hardens these parts, thereby creating a pattern. The resultant pattern on the film is then subjected to a chemical solution that functions in the removal of the non-hardened parts of the film, leaving behind only the hardened parts that constitute the desired image of the circuit pattern.
The process of selectively etching copper involves sensitive film coverage and chemical erosion. Parts without copper are left exposed. Copper molecules in the film are gradually eroded, resulting in a distinct distribution pattern. A transparent portion of the substrate emerges where copper is etched away. This presents an opportunity for exploration and investigation.
The circuit board manufacturing process is nearing completion. The next step is to remove all photosensitive films to form the inner circuit. This step is crucial and requires great care and precision. Once the films are extracted, we conduct automatic optical inspection (AOI) on the board surface. This ensures optimal functionality. Only then can we confidently declare the circuit board ready for use.
The production of an oxide coating serves as a means to amplify the bonding strength of a given surface within the platen program. But how does one go about achieving such a feat? Well, fear not, for the solution lies in the chemical treatment of copper, which leads to the formation of a coarsened surface. This surface, when implemented within the platen process, is imbued with enhanced bonding strength. In essence, the process involves the creation of an oxide coating, a feat that is not for the faint of heart.
Platen is a critical process to synthesize the inner laminate multilayer circuit board, the steps of the inner plate can be found in the process of multilayer circuit board pressing materials: copper foil, chemical sheet and plate.
The plate arrangement step is to stack the oxidized plate according to the inner structure of the circuit board. The plate needs to be placed between the two layers, which is used as the "glue" between the layers. The copper film is normally used for the outermost layer of the structure. The inner sheet, copper foil, and chemical sheet are joined together at high temperature and pressure during the pressing process, usually in a vacuum.
A pressed plate is shaped after the plate is laid out.
After the drilling process, the drilled holes are electrically connected to the pressed plate by the subsequent copper plating process.
After drilling, burr removal and glue removal are the next steps to keep the hole and surface clean. Burr removal is a mechanical process that removes burrs from holes in the surface of a plate. Degumming is a chemical process designed to remove the thermal residue from drilling holes.
Copper deposition, also known as electroprecipitation-free copper, is a thin layer of copper deposited on the plate surface and hole wall by chemical reaction. This forms a layer of metal for later plating operations. The graphic transfer process is similar to the inner layer process, including dry film photosensitive film coating, photosensitive film exposure, dry film development and electroplating copper and tin, desiccating film, etching of unwanted copper and desiccating photosensitive film exposure and development of electroplated copper and tin.
Etching is the etching of copper that is not covered by tin. Lines and pads defined on the wiring diagram will now remain on the board.
Tin removal is the chemical removal of tin plating as an etching inhibitor from the surface of a plate, resulting in an exposed copper plate.
The weld-proof ink process forms a protective coating over the entire line board surface to prevent contamination, operational damage and facilitate subsequent assembly. After cleaning the plate surface sequence, the curtain type or screen printing type is covered with a layer of green oil on the plate surface, and then the same is sent to the exposure, development and the formation of a pattern.
Selective surface treatment processes are designed to surface at certain locations for engaging electronic components or parts to a circuit board. Tin SPRAYING (ONE OF THE TYPICAL SURFACE TREATMENTS) - THE circuit board IS processed through a molten tin cylinder, which covers all the exposed copper surface, and then blows hot air at high pressure to both sides of the board simultaneously to remove excess tin from the holes and surface.
After that, the text ink will be silkscreened to the circuit board according to the customer's wiring diagram. Print the printed ink detailing the parts placement and other surface information required by the customer, then bake the circuit board until the ink is cured.
The board will be gong or beamed to the desired shape. This operation is also known as shape machining. It includes beamed the board with a mold, the gong board on the gong board machine, cutting the V shape for later disassembly, and removing the corners for easy operation.
The board will test the integrity of the power supply, which is an open/short circuit test. Impedance will be tested if necessary.
What REMAINS IS THE FINAL INSPECTION, WHICH IS ALSO a critical process, to determine THAT ALIDA CAN deliver a completely reliable circuit board. This procedure includes appearance inspection and panel bending test. Finally, the circuit board will be packed as required and shipped to the destination specified by the customer.
First of all, this is a semi-finished USB port, and you can see that the USB port is attached to the circuit board, which has a series of electronic components on it. Next, I’ll tell you how to make a USB port. In the first step, the engineer designed the circuit on the circuit board, and then we operated the Surface Mount System to accurately place the Surface Mounted Devices(SMD) on the PCB solder pad with the mobile mount head. Next, we put the processed PCB plate into the Reflow Oven for the indispensable oven welding. Then we Solder the electronic components and USB ports onto the PCB, and Solder Pot them to the pcb. After Solder pot cooled, a semi-finished PCB board was finished.
Now many power strips are equipped with USB ports, which is a change in response to people’s needs. Generally, when we charge products such as smartphones, we need a power adapter and a USB cable. After the two are connected, connect to the power supply. Or a power strip can be used to charge the device. If you have a power strip with a USB port, you don’t need to use a power adapter, and some power adapters are relatively large and may take up space on other sockets on the power strip. , the use of the USB port can perfectly avoid this trouble, so that the entire power strip looks in order after connecting to many devices.
First of all, we need to understand that a power strip has its limits and its rated voltage. A power strip itself cannot be connected to too many high-power electrical appliances (or electrical appliances with high instantaneous power). If the socket is not enough, connect If another power strip is installed, it is likely that the actual power will exceed the rated power of the first power strip, so in principle we shouldn’t connect power strips. If so, what are the actual consequences? The current passing through the power strips will increase beyond its normal working capacity, and then it will heat up, which may melt the outer casing of the power cord, causing a great fire hazard, so please do not do this.
The surge protector here essentially refers to the power strip with the “surge protector” installed. That’s right, the surge protector is actually a small component, an overload protector. It can be installed on the power strip to protect the power strip and other devices. Power strips with overload protection and lightning protection functions are also called surge protectors, while general power strips have no overload protection function, which is equivalent to an extension of the power cord. The prices of the two are different, and you should decide which product you should use according to your own needs. If you use high-power or instantaneous power appliances, it is best to choose surge protectors. If there are fewer connected appliances and the power is relatively high If it is low, it is no problem to choose ordinary power strips.
Extension cords can actually be counted as a sub-category of power strips, and some power strips with very long power cords can be called extension cords. There are also some sockets with only one or very few sockets, only one plug, and the main body is wired. These are also called extension cords. UKEO also accepts customized extension cords. Welcome to consult.
Factory Address:Wuqu Industrial area,Shouning city,Fujian,China
Brand Office Address: No.1780 Wenzhou Av. Lucheng district,
Wenzhou,Zhejiang,China.
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